Blank Cover Image

Pretreatment Effects on Void Formation for Low Temperature Si-Si Bonded Wafers

Author(s):
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-19
Pub. Year:
2003
Page(from):
233
Page(to):
238
Pages:
6
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566774024 [1566774020]
Language:
English
Call no.:
E23400/200319
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Hydrophobic Low Temperature Wafer Bonding; Void Formation in the Oxide-Free Interface

Amirfeiz, P., Sanz-Velasco, A., Bengtsson, S.

Electrochemical Society
7 Conference Proceedings Effects of Magnetic Field Intensity on Microstructure and Orientation of Proeutectoid Ferrite in Fe-C Alloy

X.X. Zhang, Y.D. Zhang, S.J. Wang, C. Esling, X. Zhao

Trans Tech Publications
2 Conference Proceedings Model of dislocations at the interface of bonded wafers

Han,W., Yu,J., Wang,L., Wei,H., Zhang,X., Wang,Q.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Deformation Behavior of Polycrystalline Fe-Ga-B Alloy at Elevated Temperature

J.H. Li, X.X. Gao, J. Zhu, X. Bao, M.C. Zhang

Trans Tech Publications
3 Conference Proceedings Microstructure of Composite Cementation Layer on Two-Phase TiAl-Based Alloy and Its Effects on Oxidation Resistance

Liang, W., Ma, X.X., Bian, L.P., Zhao, X.G., Zhang, J., Zou, D.X.

Trans Tech Publications
9 Conference Proceedings Operation of Double Gate Graded-Channel Transistors at Low Temperatures

M. A. Pavanello, J. A. Martino, T. M. Chung, A. Kranti, J.-P. Raskin, D. Flandre

Electrochemical Society
4 Conference Proceedings Property Responses in Nb-Si-Hf-Ti-Al-W-B-Cr Alloys for High-Temperature Applications

X.X. Yang, J.B. Sha, H. Zhang

Trans Tech Publications
10 Conference Proceedings On-Wafer Wideband Characterization: from Technology Improvements to Compact Models for Advanced MOS Devices

J.-P Raskin, G. Pailloncy, D. Lederer

ESA Publications Division
5 Conference Proceedings Influence of a Ductile Interlayer on the Toughness of Hydrophilic Wafer Bonding

Bertholet, Y., Raskin, J.P., Pardoen, T.

Electrochemical Society
11 Conference Proceedings Stuy on Microwave-Assisted Grinding of Low-Grade Ludwigite

Y.J. Liu, T. Jiang, Z. Deng, X.X. Xue, P.N. Duan

Trans Tech Publications
6 Conference Proceedings Temperature dependence of RF losses in high-resistivity SOI substrates

Lederer, D., Raskin, J. -P.

Kluwer Academic Publishers
12 Conference Proceedings Partially depleted SOIt dynamic-threshold MOSFET for low-voltage and microwave applications

Dehan, M., Raskin, J.-P., Vanhoenacker, D.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12