3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects
- Author(s):
Lu, J.-Q. Jindal, A. Kwon, Y. McMahon, J.J. Lee, K-W. Craft, R.P. Altemus, B. Cheng, D. Eisenbraum, E. Cale, T.S. Gutmann, R.J. - Publication title:
- Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2003-13
- Pub. Year:
- 2003
- Page(from):
- 381
- Page(to):
- 389
- Pages:
- 9
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773935 [1566773938]
- Language:
- English
- Call no.:
- E23400/200313
- Type:
- Conference Proceedings
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