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Characteristics of Low-k Methyl-Silsesquiazane (MSZ) for CMP Process Using Oxygen Plasma Treatment

Author(s):
Liu, P.T.
Chang, T.C.
Tsai, T.M.
Yan, S.T
Chang, Y.C.
Acki, H.
Tseng, T.Y.
2 more
Publication title:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-13
Pub. Year:
2003
Page(from):
237
Page(to):
243
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773935 [1566773938]
Language:
English
Call no.:
E23400/200313
Type:
Conference Proceedings

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