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Atomic Layer Deposition of Ruthenium Glue Layer for Copper Damascene Interconnect

Author(s):
Publication title:
Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-13
Pub. Year:
2003
Page(from):
181
Page(to):
205
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773935 [1566773938]
Language:
English
Call no.:
E23400/200313
Type:
Conference Proceedings

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