Effect of Novel Plasma Treatment on Superfilling Behavior in Chemically Enhanced CVD (CECVD) Cu Process

Effect of Novel Plasma Treatment on Superfilling Behavior in Chemically Enhanced CVD (CECVD) Cu Process

Author(s):

Publication title:

Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-13

Pub. Year:

2003

Page(from):

93

Page(to):

99

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773935 [1566773938]

Language:

English

Call no.:

E23400/200313

Type:

Conference Proceedings

Details

TDL ID:	ZA00014077
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Thin Film Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
Conf. info. (Number):	2003 ; 203rd
Conf. info. (Venue):	Paris, France
Conf. info. (Date):	2003.04.27-2003.05.02

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