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ECD Seed Copper Layer for Seed Enhancement in Advanced Interconnects

Author(s):
Haumesser, P.H.
Da Silva, S.
Cordeau, M.
Avale, X.
Pallet, O.
Mourier, T.
Passemard, G.
Baskaran, R.
Ritzdorf, T.
4 more
Publication title:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-10
Pub. Year:
2003
Page(from):
6
Page(to):
15
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
Language:
English
Call no.:
E23400/200310
Type:
Conference Proceedings

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