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Structural Comparison Between Cu(hfac)(VTMS) and Cu(hfac)(MHY): An Answer to Differences in Copper Film Deposition

Author(s):
Publication title:
Chemical vapor deposition XVI and EUROCVD 14 : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-8
Pub. Year:
2003
Page(from):
1268
Page(to):
1274
Pages:
7
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773782 [1566773784]
Language:
English
Call no.:
E23400/200308
Type:
Conference Proceedings

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