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Impact of Wafer Backside Cu Contamination to 0.18 um Node Devices

Author(s):
Publication title:
ULSI Process Integration : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2003-6
Pub. Year:
2003
Page(from):
447
Page(to):
454
Pages:
8
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773768 [1566773768]
Language:
English
Call no.:
E23400/200306
Type:
Conference Proceedings

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