Enhancement of Post Copper CMP Cleaning Using CO2 Cryogenic Technology
- Author(s):
- Publication title:
- Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2002-22
- Pub. Year:
- 2002
- Page(from):
- 293
- Page(to):
- 301
- Pages:
- 9
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773799 [1566773792]
- Language:
- English
- Call no.:
- E23400/200222
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
8
Conference Proceedings
POST-ETCH CLEANING OF 300 mm DUAL DAMASCENE LOW-k DIELECTRIC STRUCTURES USING SUPERCRITICAL CO2
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |
11
Conference Proceedings
Single-pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser
SPIE - The International Society of Optical Engineering |
6
Conference Proceedings
Characterization of photomask surface cleaning with cryogenic aerosol technique [5922-54]
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |