Blank Cover Image

Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors

Author(s):
Remiat, B.
Fusalba, F.
Maury, P.
Jousseaume, V.
Lecornec, C.
Gaillard, F.
Durand, J.
2 more
Publication title:
Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2002-22
Pub. Year:
2002
Page(from):
120
Page(to):
125
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773799 [1566773792]
Language:
English
Call no.:
E23400/200222
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Copper-Barrier and Hard-Mask Elaboration by Plasma-Enhanced Chemical Vapor Deposition Using Organosilane Precursors

Remiat, B, Fusalba, F., Maury, P., Jousseaume, V, Lecornec, C., Gaillard, F., Durand, I.

Electrochemical Society
7 Conference Proceedings Chemical Vapor Deposition of Copper From a Stabilized Precursor Using Liquid Coinjection

G. A. Peterson, T.R. omstead, P.M. Smith, M.F. Gonzales

Electrochemical Society
2 Conference Proceedings Plasma Treatments and PECVD Dielectric Deposition Impact on Porous SiOC

Jousseaume, V., Maury, P., Le Cornec, C., Zenasni, A., Remiat, B, Fusalba, F., Passemard, G.

Electrochemical Society
8 Conference Proceedings Development of Antireflection Coatings Using Microwave Plasma-Enhanced Chemical Vapor Deposition

C.A. Outten, A. Haeri, P. Mounier, J. Jones

Society of Vacuum Coaters
3 Conference Proceedings Introducing Advanced ULK Dielectric Mateials in Interconnects: Performance and Integration Challenges

Fusalba, F., Cornec, C.Le, Maury, P., Remiat, B., Jousseaume, V., Haxaire, K., Mourier, T., Haumesser, P.H, Maitrejean, …

Electrochemical Society
9 Conference Proceedings Fabrication of a Free-Standing, Synthetic, Single Crystal Diamond Plate Using Ion Implantation and Plasma-Enhanced Chemical Vapor Deposition

Posthill, J. B., Malta, D. P., Humphreys, T. P., Hudson, G. C., Thomas, R. E., Rudder, R. A., Markunas, R. J.

MRS - Materials Research Society
4 Conference Proceedings Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization

Maury, F., Gasqueres, C., Duminica, F.-D., Ossola, F.

Trans Tech Publications
10 Conference Proceedings Far Cold Remote Nitrogen Plasma for the Elaboration of Hard Nitrides Films

Jama, C., Mutel, B., Baclez, E., Dessaux, O., Goudmand, P., Grimblot, J.

Electrochemical Society
5 Conference Proceedings Influence of Fluorocarbon Precursors on Pulsed Plasma Enhanced chemical Vapor Deposition

Labelle, C.B., Lau, K.K.S., Limb, S.J., Gleason, K.K.

Electrochemical Society
11 Conference Proceedings Introduction to Plasma Enhanced Chemical Vapor Deposition

Cale S. T., Raupp B. G., Rogers R. B., Myers R. F., Zirkle E. T.

kluwer Academic Publishers
6 Conference Proceedings PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION OF SILICON NITRIDE FROM NOVEL ORGANOSILANES

Grow, J. M., Levy, R. A., Yu, Y., Shih, K. T.

MRS - Materials Research Society
12 Conference Proceedings NANOSCALE Y2O3 PHASE DISPERSION IN YBa2Cu3O7-x THIN FILMS PRODUE BY PLASMA-ENHANCED METALORGANIC CHEMICAL VAPOR DEPOSITION

Lu, P., Zhao, J., Chern, C. S., Li, Y. Q., Kulesha, G. A., Gallois, B., Norris, P., Kear, B., Cosandet, F.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12