ULSI Wiring Formation by Copper Electroplating
- Author(s):
Miura, S. Ovamada, K. Watanabe, S. Sugimoto, M. Kouzai, H. Honma, H. - Publication title:
- Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 2002-22
- Pub. Year:
- 2002
- Page(from):
- 22
- Page(to):
- 29
- Pages:
- 8
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773799 [1566773792]
- Language:
- English
- Call no.:
- E23400/200222
- Type:
- Conference Proceedings
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