Effect of Slurry Dilution and Flow Rate on Coefficient of Friction and Removal Rate for ILD CMP Applications

Effect of Slurry Dilution and Flow Rate on Coefficient of Friction and Removal Rate for ILD CMP Applications

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2002-1

Pub. Year:

2002

Page(from):

237

Page(to):

245

Pages:

9

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773294 [1566773296]

Language:

English

Call no.:

E23400/2002-1

Type:

Conference Proceedings

Details

TDL ID:	ZA00014034
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	5th ; 201st
Conf. info. (Venue):	Philadelphia, PA, USA
Conf. info. (Date):	2002.05.12-2002.05.17

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