Blank Cover Image

The Chemical-Mechanical Polishing of Copper with Model Slurries

Author(s):
Publication title:
Electrochemical science and technology of copper : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-30
Pub. Year:
2000
Page(from):
103
Page(to):
116
Pages:
14
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772976 [1566772974]
Language:
English
Call no.:
E23400/200030
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects

Sainio, C., Duquette, D.J.

Electrochemical Society
7 Conference Proceedings Pulsed Electrodeposition of Copper from Alkaline and Acid Baths for Metallization in Integrated Circuits

Lee, C.Y., Duquette, D.J.

Electrochemical Society
2 Conference Proceedings Electrochemical Interactions during the Chemical Mechanical Planarization of Copper in Ammonia Based Slurries

Sainio, C.A., Duquette, D.J.

Electrochemical Society
8 Conference Proceedings Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing

Abiade, J.T., Yeruva, S., Moudgil, B., Kumar, D., Singh, R.K.

Materials Research Society
3 Conference Proceedings SURFACE LAYER FORMATION DURING THE CHEMICAL MECHANICAL POLISHING OF COPPER THIN FILMS

Steigerwald, J. M., Murarka, S. P., Duquette, D. J., Gutmann, R. J.

MRS - Materials Research Society
9 Conference Proceedings Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing

Lee, S.-M., Abiade, J., Choi, W., Singh, R.

Electrochemical Society
4 Conference Proceedings Synthesis of Model Alumina Slurries for Damascene Patterning of Copper

Lee, Byung-Chan, Duquette, David J., Gutmann, Ronald J.

Materials Research Society
10 Conference Proceedings Study of Slurry Chemistry in Chemical Mechanical Polishing (CMP) of Copper

Lee, Seung-Mahn, Mahajan, Uday, Chen, Zhan, Singh, Rajiv K.

Electrochemical Society
5 Conference Proceedings CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN WITH HOLOGEN-BASED SLURRIES

Yang, K., Gutmann, R. J., Murarka, S. P., Stonebaker, E., Atkins, H.

MRS - Materials Research Society
11 Conference Proceedings Pulsed Electrodeposition of Copper Metallization from an Alkali Bath

Krishnamoorthy, A., Lee, C.Y., Duquette, D.J., Murarka, S.P.

Electrochemical Society
6 Conference Proceedings Chemical-Mechanical Planarization Issues in Patterning Copper and Aluminum Interconnects with Magnetic Liners

Gutmann, Ronald J., Wang, Bin, Lee, Byung-Chan, Paul Chow, T., Duquette, David J.

Electrochemical Society
12 Conference Proceedings Electrochemical Testing of Tantalum and Copper in Chemical Mechanical Polishing Slurries

Z. Lin, H. Li, R. Schmidt, R. Baker

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12