Electrodeposition of Copper onto Si(111) with Controlled Surface Structure

Electrodeposition of Copper onto Si(111) with Controlled Surface Structure

Author(s):

Ji, C. ( Johns Hopkins University )
Oskam, G. ( Johns Hopkins University )
Searson, P. ( Johns Hopkins University )

Publication title:

Electrochemical science and technology of copper : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2000-30

Pub. Year:

2000

Page(from):

64

Page(to):

70

Pages:

7

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772976 [1566772974]

Language:

English

Call no.:

E23400/200030

Type:

Conference Proceedings

Details

TDL ID:	ZA00013999
Series ID:	PA00000028
Conf. info. (Name):	International symposium on electrochemical science and technology of copper ; Electrochemical Society Meeting
Conf. info. (Number):	2000 ; 198th
Conf. info. (Venue):	Phoenix, AZ, USA
Conf. info. (Date):	2000.10.22-2000.10.27

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