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Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum

Author(s):
Publication title:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-27
Pub. Year:
2000
Page(from):
32
Page(to):
46
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
Language:
English
Call no.:
E23400/200027
Type:
Conference Proceedings

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