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Effects of Copper Film Thickness on Copper CMP Performance

Author(s):
Tsai, T.C.
Chen, H.C.
Wei, Y.T.
Shida, Y.K.
Hsu, C.L.
Yang, M.S.
1 more
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-26
Pub. Year:
2000
Page(from):
269
Page(to):
272
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772938 [1566772931]
Language:
English
Call no.:
E23400/200026
Type:
Conference Proceedings

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