Morphology Evolution During Copper CMP: Comparison of Fixed Abrasive and Conventional Pads

Morphology Evolution During Copper CMP: Comparison of Fixed Abrasive and Conventional Pads

Author(s):

Publication title:

Chemical Mechanical Planarization : proceedings of the International Symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2000-26

Pub. Year:

2000

Page(from):

122

Page(to):

128

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772938 [1566772931]

Language:

English

Call no.:

E23400/200026

Type:

Conference Proceedings

Details

TDL ID:	ZA00013995
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
Conf. info. (Number):	4th ; 198th
Conf. info. (Venue):	Phoeniz, AZ, USA
Conf. info. (Date):	2000.10.23-2000.10.25

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