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Light Scattering Study of Roughness and Dishing on Post-CMP Wafers

Author(s):
Publication title:
Chemical Mechanical Planarization : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-26
Pub. Year:
2000
Page(from):
56
Page(to):
74
Pages:
19
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772938 [1566772931]
Language:
English
Call no.:
E23400/200026
Type:
Conference Proceedings

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