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Room Temperature, Adhesive Bonding for Wafer Scale Packaging of Fluidic Microsystems

Author(s):
Publication title:
Microfabricated Systems and MEMS V : proceedings of the International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-19
Pub. Year:
2000
Page(from):
101
Page(to):
106
Pages:
6
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772860 [1566772869]
Language:
English
Call no.:
E23400/200019
Type:
Conference Proceedings

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