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Process Study of a New Copper Dry Etching Method - The HCI Chemistry

Author(s):
Publication title:
Plasma processing XIII : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-6
Pub. Year:
2000
Page(from):
361
Page(to):
367
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772716 [1566772710]
Language:
English
Call no.:
E23400/2000-6
Type:
Conference Proceedings

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