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A Highly Manufacturable Spacer Profile Solution for Void-Free Pre- Metal Dielectrics Gap-Fill in Sub-0.25 Micron Technology

Author(s):
Yu, J.
Vassiliev, V.Y
Pradeep, Y.R.
Cuthbertson, A.
Jain, A.
Zou, G.
1 more
Publication title:
Plasma processing XIII : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
2000-6
Pub. Year:
2000
Page(from):
325
Page(to):
334
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772716 [1566772710]
Language:
English
Call no.:
E23400/2000-6
Type:
Conference Proceedings

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