Effect of NH3 Plasma Treatment on Improvement of Reliability of Cu/W-B- N/HSQ Interconnect Structures

Effect of NH3 Plasma Treatment on Improvement of Reliability of Cu/W-B- N/HSQ Interconnect Structures

Author(s):

Kim, D.J. ( (Hanyang University) )
Sim, H.S. ( (Korea Institute of Science and Technology) )
Kim, Y.T. ( (Korea Institute of Science and Technology) )
Park, J.-W. ( (Hanyang University) )

Publication title:

Low and high dielectric constant materials : materials science, processing, and reliability issues : proceedings of the fifth international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2000-5

Pub. Year:

2000

Page(from):

40

Page(to):

47

Pages:

8

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772709 [1566772702]

Language:

English

Call no.:

E23400/2000-5

Type:

Conference Proceedings

Details

TDL ID:	ZA00013974
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Low and High Dielectric Constant Materials ; Meeting of the Electrochemical Society
Conf. info. (Number):	5th ; 197th
Conf. info. (Venue):	Toronto, Ontario, Canada
Conf. info. (Date):	2000.05.14-2000.05.19

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