Three-Dimensional Chemical Mechanical Polishing Process by BEM
- Author(s):
- Yoshida, Takafumi
- Publication title:
- Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 99-37
- Pub. Year:
- 1999
- Page(from):
- 593
- Page(to):
- 604
- Pages:
- 12
- Pub. info.:
- Pennington, N. J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772600 [1566772605]
- Language:
- English
- Call no.:
- E23400/99-37
- Type:
- Conference Proceedings
Similar Items:
Materials Research Society |
7
Conference Proceedings
Optimization of a Chemical Mechanical Polishing Process for Dielectric Planarization
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |
Materials Research Society |
Society of Photo-optical Instrumentation Engineers |
Materials Research Society |
SPIE - The International Society for Optical Engineering |
Materials Research Society |
11
Conference Proceedings
EFFECT OF POLISHING PAD MATERIAL PROPERTIES ON CHEMICAL MECHANICAL POLISHING (CMP) PROCESSES
MRS - Materials Research Society |
6
Conference Proceedings
The Copper Corrosion and Sulfur Contamination Generated by a Three-Step Copper Chemical-Mechanical Polishing Process
Materials Research Society |
Materials Research Society |