Effect of Slurry Abrasive Size on Polish Rate and Surface Quality of Silicon Dioxide Films

Effect of Slurry Abrasive Size on Polish Rate and Surface Quality of Silicon Dioxide Films

Author(s):

Publication title:

Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-37

Pub. Year:

1999

Page(from):

396

Page(to):

401

Pages:

6

Pub. info.:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772600 [1566772605]

Language:

English

Call no.:

E23400/99-37

Type:

Conference Proceedings

Details

TDL ID:	ZA00013965
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society ; Fall Meeting of the Electrochamical Society of Japan
Conf. info. (Number):	3rd ; 196th ; 1999
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	1999.10.20-1999.10.22

Similar Items:

1 Conference Proceedings Study of Slurry Chemistry in Chemical Mechanical Polishing (CMP) of Copper Lee, Seung-Mahn, Mahajan, Uday, Chen, Zhan, Singh, Rajiv K. Electrochemical Society	7 Conference Proceedings Effects of Particle Concentration in CMP Choi, Wonseop, Lee, Seung-Mahn, Singh, Rajiv K. Materials Research Society
2 Conference Proceedings Fundamental Study of Iodine and Iodine Based Slurries for Copper CMP Lee, Seung-Mahn, Mahajan, Uday, Chen, Zhan, Singh, Rajiv K. Materials Research Society	8 Conference Proceedings ION-BEAM POLISHING OF DIAMOND THIN FILMS Lee, Dong-Gu, Singh, Rajiv K. MRS - Materials Research Society
3 Conference Proceedings Fundamental Studies on the Mechanisms of Oxide CMP Mahajan, Uday, Lee, Seung-Mahn, Singh, Rajiv K. Materials Research Society	9 Conference Proceedings Effect of Particle Size During Tungsten Chemical-Mechanical Polishing Bielmann, M., Mahajan, V., Singh, R. K. Materials Research Society
4 Conference Proceedings Transient Electrochemical Measurements During Copper Chemical Mechanical Polishing Lee, Seung-Mahn, Choi, Wonseop, Craciun, Valentin, Singh, Rajiv K. Materials Research Society	10 Conference Proceedings Abrasive Effects in Oxide Chemical-Mechanical Polishing Bielnann, M., Mahajan, V., Singh, R. K. Materials Research Society
5 Conference Proceedings Dynamic Contact Characteristics During Chemical Mechanical Polishing (CMP) Choi, Wonseop, Lee, Seung-Mahn, Singh, Rajiv K. Materials Research Society	11 Conference Proceedings Optimal Size Distribution of CMP Slurries for Enhanced Polishing with Minimal Defects Basim, G.B., Adler, J.J., Mahajan, U., Singh, R.K., Moudgil, B.M. Electrochemical Society
6 Conference Proceedings Effect of Nano-Size Silica Abrasives in Chemical Mechanical Polishing of Copper Jung, Su-Ho, Singh, Rajiv K. Materials Research Society	12 Conference Proceedings Pulsed Laser-Assisted Particulate Cleaning of Solid Surfaces Kumar, D., Ivory, S., Mahajan, U., Singh, Rajiv K. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12