In-Situ EIS Approaches to the Aluminum CMP Slurry Charactcrization

In-Situ EIS Approaches to the Aluminum CMP Slurry Charactcrization

Author(s):

Iisu, Jyh-Wei

Publication title:

Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-37

Pub. Year:

1999

Page(from):

311

Page(to):

321

Pages:

11

Pub. info.:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772600 [1566772605]

Language:

English

Call no.:

E23400/99-37

Type:

Conference Proceedings

Details

TDL ID:	ZA00013965
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society ; Fall Meeting of the Electrochamical Society of Japan
Conf. info. (Number):	3rd ; 196th ; 1999
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	1999.10.20-1999.10.22

Similar Items:

1 Conference Proceedings A Study on Electrochemical Metrologies for Evaluating the Removal Selectivity of Al CMP Chiu, Shao-Yu, Hsu, Jyh-Wei, Tung, I-Chung, Shih, Han-C, Feng, Ming-Shiann, Tsai, Ming-Shih, Dai, Bau-Tong Electrochemical Society	7 Conference Proceedings AlGaN/GaN multiple quantum wells grown by using atomic layer deposition technique Ming-Hua Lo, Zhen-Yu Li, Shih-Wei Chen, Jhih-Cang Hong, Ting-Chang Lu, Hao-Chung Kuo, Shing-Chung Wang Materials Research Society
2 Academic Journal Characterization and photoelectrochemical performance of Zn-doped TiO₂ films by sol-gel method Li-ying QIAO, Feng-yu XIE, Ming-hui XIE, Cai-hua GONG, Wei-lang WANG, Jia-cheng GAO Editorial Office of Trans. NFsoc., Central-South University of Technology	8 Conference Proceedings ENHANCING COPPER SURFACE ROUGHNESS VIA CMP FOR OPTIMAL PERF ORMANCE HSU, CHIA-LM, Su, WEN-CHIEH, CHEN, SHU-JEN, TSAI, YU-DUAN, HUANG, CHIEN-CHUNG, TZOU, SHIH-FANG Electrochemical Society
3 Conference Proceedings A Low Cost and Efficient Volumetric-Error Measurement Method for Five-Axis Machine Tools Wang, Shih Ming, Yu, Han Jen, Liao, Hung Wei Trans Tech Publications	9 Conference Proceedings CSMA/CA Protocol for Wireless Sensor Network Based on Probability Function Detection Tan, Ming Chan, Ding, Hong Wei, Guo, Ying Ying, Zhao, Yi Fan, Shao, Han Bai Trans Tech Publications
4 Conference Proceedings HEART OF CMP POLISHER -INTEGRATED CLC SLURRY DELIVER SYSTEM DEVELOPMENT AND SUCCESSFUL IMPLEMENTATION IN IC FAB Wu, DUAN-YI, WEI-XIONG, SHI, LI, YANG-BO, LIN, PAUL-CHANG, CHIU, PO-CHENG, CHONG, CHUAN-MING, GER, TEH-WEI Electrochemical Society	10 Conference Proceedings (256m) Determination of Size and Concentration of Unlabeled Nanoparticles Using a Tunable Conical Nanopore Wei-Li Chuang, Sheng-Wei Wang, Shih-Wei Chiu, Tzung-Han Chou, Li-Hsien Yeh American Institute of Chemical Engineers
5 Conference Proceedings The Application of Digital Publishing Format in E-Reading Machine Liu, Ding Yu, Tsai, Ming Jyh Trans Tech Publications	11 Conference Proceedings A Study of Color Variance between Vacuum Plate of Aluminum and Aluminum Foil Using UV Offset Printing Chen, Chang Lang, Lo, Mei Chun, Wei, Ming Chw, Wang, Shi Wei Trans Tech Publications
6 Conference Proceedings Measurements of Residual Stress and Angular Distortion of 7075 Aluminum Alloy after Gas Tungsten Arc Welding Wu, Shih Jeh, Chung, Chiao Wei, Kuo, Chen Ming Trans Tech Publications	12 Conference Proceedings Investigation on the Social Network Service (SNS) of University Library Websites Tsai, Ming Jyh, Liu, Ding Yu, Hsu, Po Hsien Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12