ACOUSTIC PROPERTY CHARACTERIZATION OF A SINGLE WAFER MEGASONIC CLEANER
- Author(s):
- Publication title:
- Cleaning technology in semiconductor device manufacturing : proceedings of the sixth international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 99-36
- Pub. Year:
- 1999
- Page(from):
- 360
- Page(to):
- 367
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772594 [1566772591]
- Language:
- English
- Call no.:
- E23400/99-36
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
Electrochemical Society |
2
Conference Proceedings
POST ETCH/ASH CLEANING OF DUAL DAMASCENE STRUCTURES: SINGLE WAFER MEGASONICS WITH STG DRY
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
9
Conference Proceedings
MEGASONIC CLEANER CHARACTERIZATION FOR VLSI PLANARIZATION RIE POST CLEAN PROCESS
Electrochemical Society |
Electrochemical Society |
10
Conference Proceedings
Characterization study of an aqueous developable photosensitive polyimide on 300-mm wafers
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
6
Conference Proceedings
MEETING THE CRITICAL CLEANING CHALLENGES FOR 65 nm AND BEYOND USING A SINGLE WAFER PROCESSING WITH NOVEL MEGASONICS AND DRYING TECHNOLOGIES
Electrochemical Society |
12
Conference Proceedings
Characterization of a Single Wafer Multi-Chamber Clustered EPI System at Reduced Pressure
Electrochemical Society |