SINGLE WAFER POLYMER REMOVAL FOR <0.25um TECHNOLOGY

SINGLE WAFER POLYMER REMOVAL FOR <0.25um TECHNOLOGY

Author(s):

Publication title:

Cleaning technology in semiconductor device manufacturing : proceedings of the sixth international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-36

Pub. Year:

1999

Page(from):

352

Page(to):

359

Pages:

8

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772594 [1566772591]

Language:

English

Call no.:

E23400/99-36

Type:

Conference Proceedings

Details

TDL ID:	ZA00013964
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
Conf. info. (Number):	6th
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	1999.10.00

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