Blank Cover Image

Characterization of Wafer Bond Toughness

Author(s):
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
338
Page(to):
349
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Surface Passivation for Low-Temperature UHV Wafer Bonding of GaAs Substrates

Hesse, P.J., Haas, T.W., Lampert, W.V., Eyink, K.G., Tomich, D.H., Seaford, M.L.

Electrochemical Society
7 Conference Proceedings Relaxed SiGe On Insulator Fabricated via Wafer Bonding and Layer Transfer: Etch-back and Smart-cut Alternatives

Taraschi, G., Cheng, Z.-Y., Currie, M.T., Leitz, C.W., Langdo, T.A., Lee, M.L., Pitera, A., Fitzgerald, E.A., …

Electrochemical Society
2 Conference Proceedings Effect of Wafer-Scale Shape Variations and Mounting in Wafer Bonding

Turner, K.T., Spearing, S.M., Hester, P., Sinha, J., Baylies, W.A.

Electrochemical Society
8 Conference Proceedings Characterization of GaN Schottky Barrier Photodiodes With a Low-temperature GaN Cap Layer

Lee, M.L., Sheu, J.K., Su, Y.K., Chang, S.J., Lai, W.C., Chi G.C.

Electrochemical Society
3 Conference Proceedings Influence of a Ductile Interlayer on the Toughness of Hydrophilic Wafer Bonding

Bertholet, Y., Raskin, J.P., Pardoen, T.

Electrochemical Society
9 Conference Proceedings Detailed Characterization of Wafer Bonding Mechanisms

Maleville, C., Rayssac, O., Moriceau, H., Blasse, B., Baroux, L., Aspar, B., Bruel, M.

Electrochemical Society
4 Conference Proceedings An Electro-Mechanical Analysis of the Anodic Bond Process for Microelectromechanical Systems

Cunningham, S.J., DeReus, D.R., Borninski, J.W.

Electrochemical Society
10 Conference Proceedings Formation of Silicon Structures by Plasma Activated Wafer Bonding

Amirfeiz, P., Bengtsson, S., Bergh, M., Zanghellini, E., Boerjesson, L.

Electrochemical Society
5 Conference Proceedings Wafer bonding involving complex oxides

Alexe, M., Kopperschmidt, P., Gosele, U., Tong, Q-Y., Huang, L-J.

MRS-Materials Research Society
11 Conference Proceedings Sacrificial Wafer Bonding: An Addition to the Micromaching Techniques

Spiering, V.L., Berenschot, J.W., Elwenspoek, M., Fluitman, J.H.J.

Electrochemical Society
6 Conference Proceedings Mechanistic Studies of Silicon Wafer Bonding and Layer Exfoliation

Weldon, M.K., Marsico, V.E., Chabal, Y.J., Agarwal, A., Eaglesham, D.J., Sapjeta, J., Brown, W.L., Jacobson, D.C., …

Electrochemical Society
12 Conference Proceedings WAFER BONDING FOR SOI

Maszara, W. P., Goetz, G., Caviglia, T., Cserhati, A., Johnson, G., McKitterick, J. B.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12