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Contact Angle Measurement of Wafer Surfaces for Integrating Laser Diode and Optical Isolator by Wafer Bonding

Author(s):
Yokoi, H.
Mizumoto, T.
Shimizu, M.
Waniishi, T.
Futakuchi, N.
Kaida, N.
Nakano, Y.
2 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
311
Page(to):
317
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

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