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Surface Passivation for Low-Temperature UHV Wafer Bonding of GaAs Substrates

Author(s):
Hesse, P.J.
Haas, T.W.
Lampert, W.V.
Eyink, K.G.
Tomich, D.H.
Seaford, M.L.
1 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
244
Page(to):
258
Pages:
15
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

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