Strain and Strain Relaxation in SOI Materials

Strain and Strain Relaxation in SOI Materials

Author(s):

Publication title:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-35

Pub. Year:

1999

Page(from):

40

Page(to):

47

Pages:

8

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772587 [1566772583]

Language:

English

Call no.:

E23400/99-35

Type:

Conference Proceedings

Details

TDL ID:	ZA00013963
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Wafer Bonding ; Fall Meeting of the Electrochemical Society
Conf. info. (Number):	5th ; 1999
Conf. info. (Venue):	Honololu. HI, USA
Conf. info. (Date):	1999.10.00

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