Recent Advances in Gap Filling Cu Electroplating Technology*

Recent Advances in Gap Filling Cu Electroplating Technology*

Author(s):

Publication title:

Electrochemical technology applications in electronics : proceedings of the third international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-34

Pub. Year:

1999

Page(from):

38

Page(to):

43

Pages:

6

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772570 [1566772575]

Language:

English

Call no.:

E23400/99-34

Type:

Conference Proceedings

Details

TDL ID:	ZA00013962
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Electrochemical Technology Applications in Electronics
Conf. info. (Number):	3rd
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	1999.10.20-1999.10.22

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