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High-performance Integration of Copper Interconnects with Low-k Hydrogen Silsesquioxane Employing Deuterium Plasma Treatment

Author(s):
Liu, P.-T.
Chang, T.-C.
Yang, Y.L.
Cheng, Y.F.
Lee, J.K.
Shih, F.Y.
Tsai, E.
Chen, G.
Sze, S.M.
4 more
Publication title:
Interconnect and contact metallization for ULSI : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-31
Pub. Year:
1999
Page(from):
251
Page(to):
260
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772549 [1566772540]
Language:
English
Call no.:
E23400/99-31
Type:
Conference Proceedings

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