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Method of Reducing the Pattern Effects on B Penetration and TED Effect by In-Situ Poly Deposition at Wafer Backside before Rapid Thermal Processing

Author(s):
Shih, J.-R.
Lee, J.H.
Lin, B.L.
Chen, S.H.
Hwang, H.L.
Diaz, C.H.
Liew, B.K.
2 more
Publication title:
ULSI process integration : proceedings of the first international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-18
Pub. Year:
1999
Page(from):
291
Page(to):
300
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772419 [1566772419]
Language:
English
Call no.:
E23400/99-18
Type:
Conference Proceedings

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