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ECD Seed Layer for Inlaid Copper Metallization

Author(s):
Publication title:
Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-9
Pub. Year:
1999
Page(from):
122
Page(to):
133
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772310 [1566772311]
Language:
English
Call no.:
E23400/99-9
Type:
Conference Proceedings

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