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Cure Kinetics of Advanced Flip-Chip Underfill Materials

Author(s):
Hsu, D.I.
Kim, H.K.
Shi, F.G.
Chungpaiboonpatana, S.
Davidson, C.
Adams, J.M.
1 more
Publication title:
Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-7
Pub. Year:
1999
Page(from):
209
Page(to):
226
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772297 [156677229X]
Language:
English
Call no.:
E23400/99-7
Type:
Conference Proceedings

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