The Seamless High Off-Chip Connectivitity (SHOCC) Packaging Technology
- Author(s):
- Publication title:
- Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 99-7
- Pub. Year:
- 1999
- Page(from):
- 188
- Page(to):
- 194
- Pages:
- 7
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772297 [156677229X]
- Language:
- English
- Call no.:
- E23400/99-7
- Type:
- Conference Proceedings
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