Blank Cover Image

Electrochemical Characterization of Copper in Ammonia-containing Slurries for Chemical Mechanical Planarization of Interconnects

Author(s):
Publication title:
Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-7
Pub. Year:
1998
Page(from):
126
Page(to):
138
Pub. info.:
Pennington, N. J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772013 [156677201X]
Language:
English
Call no.:
E23400/98-7
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electrochemical Interactions during the Chemical Mechanical Planarization of Copper in Ammonia Based Slurries

Sainio, C.A., Duquette, D.J.

Electrochemical Society
7 Conference Proceedings Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry

Ein-Eli, Y., Abelev, E., Starosvetsky, D.

Electrochemical Society
2 Conference Proceedings Electrochemical Considerations During Chemical-Mechanical Planarization of Copper

Sainio, C., Diquette, D.J.

Electrochemical Society
8 Conference Proceedings Electrochemical Characterization of Copper and Tantalum Chemical Mechanical Planarization

Liu, J., King, M., Darsillo, M., Baum, T.

Electrochemical Society
3 Conference Proceedings An Electrochemical Mechanism of Copper Removal During Chemical Mechanical Planarization

Sainio, Carlyn, Duquette, David J.

Electrochemical Society
9 Conference Proceedings The Nucleation and Growth of Electrochemically Deposited Copper on PVD Copper and TiN using Alkaline (EDTA and NH 3) Baths

Graham, L., Steinbruchel, C., Duquette , D.J., Chen, L.

Electrochemical Society
4 Conference Proceedings The Chemical-Mechanical Polishing of Copper with Model Slurries

Lee, B-C., Duquette, D.J., Gutmann, R.J.

Electrochemical Society
10 Conference Proceedings “Seedless” Copper Electrochemical Deposition on Air Exposed TaN Barrier Layers with Pd and Ru Adhesion Promoters

N. Lay, D.J. Duquette

Electrochemical Society
5 Conference Proceedings Electrochemical Planarization of Copper

Loparco, L.J., Duquette, D.J.

Electrochemical Society
11 Conference Proceedings Pulsed Electrodeposition of Copper from Alkaline and Acid Baths for Metallization in Integrated Circuits

Lee, C.Y., Duquette, D.J.

Electrochemical Society
6 Conference Proceedings Chemical-Mechanical Planarization Issues in Patterning Copper and Aluminum Interconnects with Magnetic Liners

Gutmann, Ronald J., Wang, Bin, Lee, Byung-Chan, Paul Chow, T., Duquette, David J.

Electrochemical Society
12 Conference Proceedings Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization

R. Jia, Y. Wang, Z. Wang, S. Tsai, J. Dma, D. Mao, L. Karuppiah, L. Chen

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12