Non-contact Post-CMP Cleaning Using a Single Wafer Processing System
- Author(s):
- Publication title:
- Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 98-7
- Pub. Year:
- 1998
- Page(from):
- 81
- Page(to):
- 89
- Pub. info.:
- Pennington, N. J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772013 [156677201X]
- Language:
- English
- Call no.:
- E23400/98-7
- Type:
- Conference Proceedings
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