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Thin Nitride Barrier Self-Aligned Contact (TNBSAC) Oxide Etching in a High Density Inductively Coupled Plasma Using C4F8/CH3F/Ar Chemistry

Author(s):
Kim, J-H.
Ryu, J-O.
Kim, J-S.
Lee, B-C.
Kim, J-W.
Seol, Y-S.
1 more
Publication title:
Proceedings of the twelfth International Symposium on Plasma Processing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-4
Pub. Year:
1998
Page(from):
137
Page(to):
145
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771986 [1566771986]
Language:
English
Call no.:
E23400/98-4
Type:
Conference Proceedings

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