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Low Cost Underbump Metallisation for Flip-Chip Packages

Author(s):
Publication title:
Dielectric material integration for microelectronics
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-3
Pub. Year:
1998
Page(from):
313
Page(to):
325
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771979 [1566771978]
Language:
English
Call no.:
E23400/98-3
Type:
Conference Proceedings

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