Materials Issues in the Integration of F-doped TEOS for ULSI Applications

Materials Issues in the Integration of F-doped TEOS for ULSI Applications

Author(s):

Publication title:

Dielectric material integration for microelectronics

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

98-3

Pub. Year:

1998

Page(from):

18

Page(to):

28

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771979 [1566771978]

Language:

English

Call no.:

E23400/98-3

Type:

Conference Proceedings

Details

TDL ID:	ZA00013906
Series ID:	PA00000028
Conf. info. (Name):	Meeting of the Electrochemical Society
Conf. info. (Number):	193rd
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.05.03-1998.05.08

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