Blank Cover Image

THE INTERFACE OF SILICON SAMPLES JOINED AT ROOM TEMPERATURE BY WAFER DIRECT BONDING IN ULTRAHIGH VACUUM

Author(s):
Ploessl, A.
Scholz, R.
Bagdahn, J.
Stenzel, H.
Tu, K.N.
Goesele, U.M.
1 more
Publication title:
Silicon materials science and technology : proceedings of the Eighth International Symposium on Silicon Materials Science and Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-1(2)
Pub. Year:
1998
Page(from):
1361
Page(to):
1372
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771931 [1566771935]
Language:
English
Call no.:
E23400/98-1
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Pressureless Silicon Direct Bonding in Ultrahigh Vacuum at Room Temperature

Ploessl, A., Scholz, R., Stenzel, H., Richtel, U., Schmidthals, C.

Electrochemical Society
7 Conference Proceedings Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test

Bagdahn, J., Ploessl, A., Wiemer, M., Petzold, M.

Electrochemical Society
2 Conference Proceedings Wafer Bonding of Compound Semiconductors using Atomic Hydrogen

Akatsu, T., Ploessl, A., Stenzel, H., Goesele, U.

Electrochemical Society
8 Conference Proceedings What Determines the Bonding Speed in Silicon Wafer Bonding

Martini, T., Schmidt, E., Mack, S., Stenzel, H., Li, S., Goesele, U.

Electrochemical Society
3 Conference Proceedings Covalent Silicon Bonding at Room Temperature in Ultrahigh Vacuum

Plossl, Andreas, Stenzel, Heinz, Tong, Qin-Yi, Langenkamp, Martin, Schmidthals, Cord, Gosele, Ulrich

MRS - Materials Research Society
9 Conference Proceedings Bonding of Hydrogen-Terminated Silicon: Thermal Evolution of the Interfacial Properties

Ploessl, A., Scholz, R., Schulze, H.-J., Hopfe, S.

Electrochemical Society
4 Conference Proceedings UHV-Silicon Wafer Bonding at Room Temperature: Molecular Dynamics and Experiments

Scheerschmidt, K., Conrad, D., Belov, A., Stenzel, H.

Electrochemical Society
10 Conference Proceedings Silicon Wafer Bonding at Room Temperature by Ar Beam Surface Activation in Vacuum

Takagi, H., Maeda, R., Chung, T.R., Suga, T.

Electrochemical Society
5 Conference Proceedings Room Temperature Covalent Bonding: Effect on Interfacial Properties

Ploessl, A, Scholz, R., Akatsu, T.

Electrochemical Society
11 Conference Proceedings UHV-Bonding: Electrical Characterization of Interfaces and Application to Magnetoelectronics

Senz, S., Reznicek, A., Kumar, A., Scholz, R., Goesele, U.

Electrochemical Society
6 Conference Proceedings 'Lord Raleigh's Ghost' or A Short History of Wafer Bonding

Goesele, U., Stenzel, H.

Electrochemical Society
12 Conference Proceedings Wafer Contamination Protection by Direct Wafer Bonding and Air Jet Debonding

Alexe, M., Goesele, U.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12