Blank Cover Image

Bonded Al2O3-Covered Si-Wafers for Highly Thermally Conductive SOI-Materials

Author(s):
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. Year:
1997
Page(from):
576
Page(to):
583
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Charge carrier injection into the buried oxide of wafer bonded silicon-on-insulator materials

Bengtsson, S., Ericsson, P., Mitani, K., Abe, T.

Electrochemical Society
7 Conference Proceedings WAFER BONDING FOR SOI

Maszara, W. P., Goetz, G., Caviglia, T., Cserhati, A., Johnson, G., McKitterick, J. B.

Materials Research Society
2 Conference Proceedings Growth of Dielectric Ta2O5/HfO2 Thin Film Nanolaminate Capacitors by Atomic Layer Epitaxy

Kanniainen, T., Skarp, J., Kattelus, H.

Electrochemical Society
8 Conference Proceedings Recent Advances in Thinning of Bonded SOI Wafers by Plasma-Assisted Chemical Etching

Mumola, P.B., Gardopee, G.J., Niaguine, S.

Electrochemical Society
3 Conference Proceedings Effects of Different Prebonding Cleaning Procedures on the Buried Oxide in Bond and Etch-Back Silicon on Insulator Materials

Ericsson, P., Bengtsson, S.

Electrochemical Society
9 Conference Proceedings Recent Bonded SOI Wafer Thinning Results with Etch Rate Feedback

Neuner, J.W., Walsh, J.H., Mathur, D.P., Poultney, S.K.

Electrochemical Society
4 Conference Proceedings Wafer Bonding: a Flexible Way to Manufacture SOI Materials for High Performance Applications (Invited)

Bengtsson, S., Amirfeiz, P., Johansson, M.

Electrochemical Society
10 Conference Proceedings Recent Bonded SOI Wafer Thinning Results with a New Shape Pace Electrode

Neuner, J.W., Robbins, M.D., Mathur, D.P., Poultney, S.K.

Electrochemical Society
5 Conference Proceedings A WAFER BONDED - SOI BIPOLAR TRANSISTOR

T. Sakakibara, T. Sugisaka, S. Miura, M. Iida, O. Ishihara

Electrochemical Society
11 Conference Proceedings Screening SIMOX wafers' background doping for SOI CMOS SRAM production

Yue, J., Liou, H.K., Liu, S.T.

Electrochemical Society
6 Conference Proceedings Integration of Silicon and Diamond, Aluminum Nitride or Aluminum Oxide for Electronic Materials

Bengtsson, S., Bergh, M., Soderbarg, A., Edholm, B., Olsson, J., Ericsson, P., Tiensuu, S.

MRS - Materials Research Society
12 Conference Proceedings Device Applications Using Bonded SOI Wafers

Fujino, S., Himi, H., Fukada, T., Yamaguchi, H.(Invited)

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12