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Adhesion Enhancement at Co(P) Diffusion Barrier/Polyimide Interfaces

Author(s):
Publication title:
Proceedings of the Symposium on Interconnect and Contact Metallization
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-31
Pub. Year:
1997
Page(from):
173
Page(to):
181
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771849 [1566771846]
Language:
English
Call no.:
E23400/97-31
Type:
Conference Proceedings

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