Electrical Characteristics of CVD Copper Interconnects and Vias

Electrical Characteristics of CVD Copper Interconnects and Vias

Author(s):

Nguyen, T.

Publication title:

Proceedings of the Symposium on Interconnect and Contact Metallization

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

97-31

Pub. Year:

1997

Page(from):

120

Page(to):

128

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771849 [1566771846]

Language:

English

Call no.:

E23400/97-31

Type:

Conference Proceedings

Details

TDL ID:	ZA00013893
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Interconnect and Contact Metallization ; Fall Meeing of the Electrochemical Society
Conf. info. (Number):	1997 ; 1997
Conf. info. (Venue):	Paris, France
Conf. info. (Date):	1997.08.31-1997.09.05.

Similar Items:

1 Conference Proceedings High Performance Buried Silicon-Germanium Channel PMOST Fabricated Using Rapid Thermal Processing and Shallow Trench Isolation Tweet, D.J, Hsu, S.T., Evans, D.R., Ulrich, B., Ono, Y., Stecker, L. Electrochemical Society	7 Conference Proceedings Thermal Stability of Organic Interlayer with Low Dielectric Constant Hara, T., Takasoh, J., Yang, H., Tweet, D.J., Nguyen, T., Ma, Y., Evans, D.R., Hsu, S.T. Electrochemical Society
2 Conference Proceedings Multilevel Damascene Interconnection in Integration of MOCVD Cu and Low-K Fluorinated Amorphous Carbon Evans, D. R., Hsu, S-T., Nguyen, T., Stecker, L. H., Ulrich, B., Yang, H. Materials Research Society	8 Conference Proceedings Prevention of Corner Voiding in Selective CVD Deposition of Titanium Silicide on SOI Device Maa, J-S., Ulrich, B., Stecker, L., Stecker, G., Hsu, S. T. MRS - Materials Research Society
3 Conference Proceedings Microtexture And Strain In Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	9 Conference Proceedings STRESS AND ADHESION OF CVD COPPER AND TiN Nguyen, Tue, Evans, David R. MRS - Materials Research Society
4 Conference Proceedings Microtexture and Strain in Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	10 Conference Proceedings Manufacturing issues in copper chemical vapor deposition processes T. Nguyen, L.R. Allen, S.-T. Hsu Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings Copper metallization for on-chip interconnects Gelatos,A.V., Nguyen,B.-Y., Perry,K.A., Marsh,R., Peschke,J., Filipiak,S., Travis,E.O., Thompson,M.A., Saaranen,T., … SPIE-The International Society for Optical Engineering	11 Conference Proceedings Effect of Post-Annealing on the Electrical Properties of ZrO₂ and ZrAIO M. Mansouri, Y.-L Chiou, Y. Ono, S. T. Hsu Electrochemical Society
6 Conference Proceedings Monitoring of highly selective plasma etch processes J.-S. Maa, L.R. Allen, D. Evans, T.-Y. Hsieh, B.D. Ulrich Society of Photo-optical Instrumentation Engineers	12 Conference Proceedings Electromigration in sub-micron Copper Interconnects in Low-k Dielectrics B. Agarwala, K. Chanda, H. S. Rathore, D. Nguyen, C. Hu, P. Mclaughlin, J. Demarest, L. Clevenger, C. Yang Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12