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Application of Plasma and Flow Modeling to the Design of Optimized Aluminum Etch Equipment

Author(s):
Publication title:
Proceedings of the Second International Symposium on Process Control, Diagnostics, and Modeling in Semiconductor Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-9
Pub. Year:
1997
Page(from):
251
Page(to):
259
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771368 [1566771366]
Language:
English
Call no.:
E23400/97-9
Type:
Conference Proceedings

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