Integration of Low-k Dielectric s for High Performance 0.18um Interconnects

Integration of Low-k Dielectric s for High Performance 0.18um Interconnects

Author(s):

Singh, A.

Publication title:

Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

97-8

Pub. Year:

1997

Page(from):

102

Page(to):

111

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771351 [1566771358]

Language:

English

Call no.:

E23400/97-8

Type:

Conference Proceedings

Details

TDL ID:	ZA00013879
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Low and High Dielectric Constant Materials
Conf. info. (Number):	2nd
Conf. info. (Venue):	Montreal, Quebec, Canada
Conf. info. (Date):	1997.05.04-1997.05.09

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