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Using Variation Decomposition Analysis to Determine the Effect of Process on Wafer- and Die-Level Uniformity in Oxide CMP

Author(s):
Ouma, D.
Stine, B.
Divecha, R.
Boning, D.
Chung, J.
Ali, I.
Shinn, G.
Islamraja, M.
3 more
Publication title:
Proceedings of the First International Symposium on Chemical Mechanical Planarization
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
96-22
Pub. Year:
1996
Page(from):
164
Page(to):
175
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771726 [1566771722]
Language:
English
Call no.:
E23400/970318
Type:
Conference Proceedings

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