Low Pressure Chemical Vapor Deposition of Copper Films by Direct Injection of(hfac)Cu(TMVS)

Low Pressure Chemical Vapor Deposition of Copper Films by Direct Injection of(hfac)Cu(TMVS)

Author(s):

Publication title:

Proceedings of the Thirteenth International Symposium on Chemical Vapor Deposition

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

96-5

Pub. Year:

1996

Page(from):

782

Page(to):

786

Pages:

5

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771559 [1566771552]

Language:

English

Call no.:

E23400/962104

Type:

Conference Proceedings

Details

TDL ID:	ZA00013838
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Vapor Deposition - CVD
Conf. info. (Number):	13th
Conf. info. (Venue):	Los Angeles, CA, USA
Conf. info. (Date):	1996.05.05-1996.05.10

Similar Items:

1 Conference Proceedings Low Pressure Chemical Vapor Deposition of Silicon Nitride Using the Environmentally Benign Precursor Tris(Dimethylamino)silane Levy, R.A., Lin, X., Grow, J.M. Electrochemical Society	7 Conference Proceedings Kinetics of Copper Chemical Vapor Deposition From Cu(hfac) VTMS Heerdt, M. L. H. ter, Put, P. J. van der, Schoonman, J. MRS - Materials Research Society
2 Conference Proceedings Some Effects of Hydrogen on Cu(TMVS)(HFAC) Sourced CVD of Copper Films Srinivas, J.Hong.S., Yang, D., Cole, T.S. Electrochemical Society	8 Conference Proceedings Kinetics of Copper Chemical Vapor Deposition from CU(HFAC)VTMS ter Heerdt, M.L.H., van der Put, P.J., Kelder, E.M., Schoonman, J. Electrochemical Society
3 Conference Proceedings *LOW PRESSURE CHEMICAL VAPOR DEPOSITION OF TUNGSTEN AND ALUMINUM FOR VLSI APPLICATIONS Levy, R.A., Green, M.L. Materials Research Society	9 Conference Proceedings CVD Cu Films Deposited From Cu(hfac)TMVS Lin, P.-J., Chen, M.-C. Electrochemical Society
4 Conference Proceedings Plasma Enhanced Chemical Vapor Deposition of Silicon Dioxide and Nitride Films Using the Enviromnentally Benign Precursor Diethylsilane Chen, L., Levy, R.A., Grow, J.M., Yu, Y. Electrochemical Society	10 Conference Proceedings A New Low Temperature Chemical Vapor Deposition Technique for Growing Thin Films of Ti, TiN on Copper and TiO2, TixSiy on Silicon Hendricks, J. H., Aquino, M. I., Zachariah, M. R. MRS - Materials Research Society
5 Conference Proceedings Chemical Vapor Deposition of Silica Films from Silane/Oxygen Mixtures in a Cold-Wall Reactor Ojeda, F., Albella, J.M. Electrochemical Society	11 Conference Proceedings RAPID CHEMICAL VAPOR DEPOSITION OF YBa2Cu3Ox COATINGS Lackey, W.J., Carter, W.B, Hill, D.N., Barefield, E.K., Hanigofski, J.A., Shaprio, M.J., Moss, III., T.S., Green, A.J., … Materials Research Society
6 Conference Proceedings Evolution Of Surface Morphology During Cu(TMVS)(hfac) Sourced Copper CVD Yang, D., Hong, J., Cale, T.S. Materials Research Society	12 Conference Proceedings Growth Kinetics And Properties of Silicon Carbide Films Synthesized by Low Pressure Chemical Vapor Deposition Grow, J.M. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12